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CPS Aluminum Silicon Carbide (AlSiC) metal matrix composite materials and products are designed to have a High Thermal Conductivity and a Controlled Thermal Expansion behavior that will be compatible with your application and assembly. The Coefficient of Thermal Expansion (CTE) of the AlSiC composite is controlled and can be modified by the composition of Al-metal and SiC-particulate. The AlSiC metal matrix thermal conductivity and weight are similar to Al-metal, with controlled thermal expansion values that can be 1/2 to 1/3 that of Al-metal depending upon your application and need.

The CPS AlSiC fabrication process not only produces the composite material but also fabricates the product geometry for a cost-efficient, highly manufacturable product. This process allows competitive pricing with other material choices while providing exceptional thermal management in a light-weight, high-strength, high-stiffness product. The CPS manufacturing capability is currently handling production volumes as few as tens of pieces to tens of thousands daily.

Typical Applications:
• Microprocessor Lids/Heat Sinks
• ASIC/Flip Chip Lids
• Microwave Housings
• Optoelectronic Housings / Bases
• Power Substrates
• IGBT Baseplates
• Coolers – Active (liquid) and Passive
(phase change material reservoirs)
• Heat Spreaders / Pin Fins
• Structural Applications
Advanced Applications:
• Concurrent Integration™ of high heat
dissipation and spreading materials:
Diamond, TPG.
• Integration of cooling tubes – functional
components
• Integration of ceramic and metal inserts