Manufacturing Equipment
Wafer Level Bumping & Back-End

Pac Tech provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries. This equipment is divided into three separate platforms: e-Ni/Au Plating, Solder Bumping, and Backend Assembly.

The cornerstone to PacTech's equipment offering is the fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300). This sytem allows for processing 100-300mm wafers with Ni, Pd, and Au at volumes of over 600,000 parts per year. In addition, Pac Tech offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (SpinPac), megasonic solvent cleaning (MegaPac).

Pac Tech offers two different equipment platforms for depositing solder on top of the e-Ni/Au UBM. These include the Laser Assisted Solder Jetting (SB²) tools and the Solder Sphere Transfer (UltraSB²) tools. The laser based tool is ideal for prototyping and low volume bumping applications like MEMS, Military, and Medical; but also for special bumping applications like: single die, probe cards, substrates, and disc drive heads. The Solder Transfer tool is ideal for high yield and high volume bumping applications.

To facilitate a full turn key solution to their equipment line, Pac Tech offers a full set of additional equipment for Wafer Level Packaging and Backend applications, including: laser based assembly tools LAPLACE™ FC and WLP, Automated Optical Inspection (AOI HS³) and Laser Marking (LS²).