Advanced Packaging Center (APC) was founded in 2010 in The Netherlands, as a spin-off company of Boschman Technologies, manufacturing moulding and sintering equipment for the electronic industry since 1987.

APC is a one-stop-shop supplier of packaging development and technology transfer solutions for advanced semiconductor-, power-, sensor- and optical-devices (including MEMS).

APC focuses on advanced package requirements and develops custom packages from concept design, through feasibility evaluation, modelling, simulation and prototyping.

APC has considerable expertise in Film Assisted Moulding (FAM) and provides its specific know-how in the Silver sintering technology, which is replacing traditional soldering for applications where superior reliability is required.

APC has worked on many projects in the MEMS sensor area (including finger-print sensors, bio-sensors, image sensors, optical communication, pressure sensors), in power electronics (for instance power inverter modules for HEV and EV automotive), as well as in LED (HB-Led) and green energy (CPV receiver).

APC has in-house equipment for wafer dicing, soldering die-attach, Ag-sintering, wire-bonding, moulding. APC offers development, qualification, prototyping and small to medium volume manufacturing, to customers who have their own in-house assembly capabilities and to fabless that wants to bring in a new manufacturing process. When the development phase is completed and the manufacturing processes are confirmed, APC can transfer the product to a mass production site.